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MCFF > MFF>Equipment> Sputter Tool - 6 inch

Equipment

Sputter Tool - 6 inch

PE 2400 6’’ Sputtering

Log on
1) Check the white board, the log book and the vacuum to make sure no one is using the machine and it is in good status.
2) Sign in the log book and write down your name on the white board


Venting the chamber-From Hi-Vac
1) Close the Hi-Vac valve
2) Turn off the gauge (IG1)
3) Open the vent valve
4) Wait for the chamber to reach atmosphere pressure (~7.2E2 Torr)
Note: To vent from a rough vacuum, close the roughing valve before opening the vent valve.


Pump down from Atmosphere (all pumps on)
1) Open chamber and set the samples
2) Close chamber
3) Close vent valve
4) Close fore-line valve
5) Open the roughing valve
6) Wait for the pressure to reach (5E-2)Torr


Pump from<50mTorr to High Vacuum
1) Close the roughing valve
2) Open the fore-line valve
3) Let the fore-line valve evacuate
4) Open the Hi-Vac valve
5) Turn on the gauge (IG1) to check the pressure (<=E-4 Torr)
6) Wait for chamber to reach desired pressure (2E-6 Torr in ~2.5h)


Before Sputtering
1) Turn on the water for head
2) Switch the Power supply to “on”
3) Turn off the gauge (IG1)
4) Close throttle valve (switch to up position)
5) Switch on argon gas , set the flow rate and wait until the pressure is stable (~7.4E-3 Torr for 10 Sccm)


Pre-Etching samples (5mins)
1) Set Load?5.00
Tune?3.05
Table position?Etch
Target selector?Etch
Mode? Sputter etch
2) Power , Power Adjust
a. Press on the white button on the panel (suppose to see the light inside the button on)
b. Slowly turn up the power and check if the plasma is on. The reflected power should not exceed 10 watt. If the plasma is on, the target bias should not be 0 and the purple light should show up inside the chamber. If there is no plasma, press the ignition button.
c. Adjust the Tune and Load to minimize the reflected power and increase the forward power to a desired level (usually 100 watt). Retune when it is needed.
d. Turn down the power to 0 and press off the white button on the panel after the etching/sputtering is done

 

After sputtering
1) Gas off ( Argon valve to “shut”)
2) Open throttle valve (switch to down position)
3) Target position? Etch
4) Switch the Power supply to “off”
5) Water off
6) a. Close the Hi-Vac valve
b. Make sure the gauge IG1 is close
c. Open the vent valve
d. Wait for the chamber to reach atmosphere pressure
7) Open chamber and take out the samples
8) Close chamber
9) Close vent valve
10) Follow the pump down process


Log off
1) Sign off the log book and add 2.5h as the pump down time
2) Wipe off your name on the white board

PDF COPY


 

 

Microfabrication Facility
Michigan Technological University

436 Minerals and Materials
Building
1400 Townsend Drive
Houghton, MI 49931-1295
906 369-2662(voice)
906 487-2949 (fax)
William Knudsen, Director
wknudsen@mtu.edu